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Mil-C-14550B, Copper, (Under Coat)
Copper in color and matte to a very shiny finish. Good corrosion resistance when used as undercoat. A number of copper processes are
available, each designed for a specific purpose:
Brightness (to eliminate the need for buffing)
High speed: (for electroforming)
Fine grain: (to prevent casehardening) Spec. Thickness
Class 00 .001 - .005
Class 1 .001 minimum thickness.
Class 2 .0005 minimum thickness. Typically used as an undercoat for nickel and other platings.
Class 3 .0002 minimum thickness. To prevent basis metal migration into tin (prevents poisoning
solder-ability).
Class 40 .0001"To prevent basis metal migration into tin (prevents poisoning solderability).
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