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Thermal and Mechanical Reliability of Five COTS MEMS Accelerometers

This is a detail test report of Micro-electro-mechanical sensor systems (MEMS Sensors) for a variety of applications in space and launch operations. These applications include health and status monitoring, environmental monitoring, automated control, repair and service.

Thermal Cycling Heterostructure Field Effect Transistors

Thermal Cycling Characterization of Complementary Heterostructure Field Effect Transistors (CHFETs) Test Report

Effect of Extreme Environmental Thermal Cycling

Effects on COTS MEMS Pressure Sensor. Abstract: Motorola's commercial of the self (COTS) manifold absolute pressure sensors test results and report.

JEDEC Solid State Technology Association

JEDEC - Solid State Technology Association is the semiconductor engineering standardization body of the Electronic Industries Alliance EIA.

MIL-STD 202

Thermal shock methods defining temperature shock for air to air and liquid to liquid thermal shock testing.

MIL-STD 883

Military Standard 883E is what the JEDEC specification is generally based on.

EIA, Electronics Industries Association

EIA's JEDEC, Solid State Products Engineering Council's published specifications for environmental testing. The JESD22 group of specifications include temperature/humidity, thermal shock, and HAST. Thermal shock testing maybe found under JESD22-A104-B "Temperature Cycling" Registration is required.

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