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World-first 300mm-fab self-assembly line
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Directed Self-Assembly (DSA) is gaining momentum as a means for extending optical lithography beyond its current limits. DSA is an alternative patterning technology that enables frequency multiplication through the use of block copolymers. When used in conjunction with an appropriate pre-pattern that directs the orientation for patterning, DSA can reduce the pitch of the final printed structure. Moreover, DSA can be used to repair defects and repair uniformity in the original print. This repair feature is especially useful in combination with EUV lithography, which today is characterized by local variation in the CD (critical dimension), especially in case of small contacts.
14nm polystyrene lines on 28nm pitch after PMMA removal fabricated by DSA using 193nm immersion based 84nm pitch pre-pattern (left) and demonstration of the ability to repair a 200nm gap in the pre-pattern (right). |
Prof. Paul Nealey: "Juan de Pablo and I and the University of Wisconsin team are very pleased to have the opportunity to partner with imec. Our work together results in unprecedented integration of DSA with manufacturing-ready tools and materials, allows investigation of the ultimate potential and possible limits of DSA not possible in an academic setting, and provides exceptional educational opportunities for our students. We are gratified to be on a pathway with imec towards commercialization of technology we have spent almost 15 years developing."
This research offering is part of imec's Advanced lithography program, available to imec's partners in its core CMOS programs. Imec's key core CMOS partners are Globalfoundries, INTEL, Micron, Panasonic, Samsung, TSMC, Elpida, Hynix, Fujitsu and Sony.
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