Posted By<" ">Dave on December 18, 2001 at 09:06:28:
In Reply to: Zine migration posted byBen on December 17, 2001 at 23:42:50:
: I am an electronic engineer and puzzled by "metal migration" problem on component leads coating. it is highly appreciated if any one can give me some idea on the following phenomenon:
: The lead is copper alloy and coated with tin-lead plating. After a high temperature (~60 - 80C) process for hours, the solderability decreases due to zine migration from the alloy to the surface.
: Here is my questions:
: 1. Does the decrease in solderability be caused by zine migration? Or do those metals can be migrated so easy?
: 2. Does the "high temperature", only 60 - 80C for several hours, cause such metal migration? Or other reason?
: Thank you in advance if any anybody can help.
Try defluxing prior to soldering
< "> Subject: Re: Re: Zine migration
[ Home ][ Forum Archive ] [ Active Engineering Forum ]
© Copyright 2000 - 2018, by Engineers Edge, LLC All rights reserved. Disclaimer