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Copper CU electrolytic plating


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Posted By<" ">S.Allen on September 21, 2002 at 22:58:03:

I am trying to create an MS Excel formula to calculate the rate of copper deposition in a Sulfuric Acid / Copper Sulfate type plating bath (such as used in the Printed Circuit Industry).

I understand that the theoretical deposition rate at 17.8 amps per sq.ft. for 60 minuits = .001 mil.

However what would the equation look like to calculate the increase in time at incrementally lower amperages?

Any help for a idiot would be welcome?


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