Natural Convection Radiation Thermal Resistance Table of Heat Sinks

Related Resources: heat transfer

Natural Convection Radiation Thermal Resistance Table of Heat Sinks

Heat Transfer Engineering
Thermodynamics
Engineering Physics

Combined natural convection and radiation thermal resistance of various heat sinks used in the cooling of electronic devices between the heat sink and the surroundings. All fins are made of aluminum 6063T-5, are black anodized.

HS 5030	R = 0.9°C/ W (vertical) R = 1.2°C/W (horizontal) Dimensions: 76 mm x 105 mm x 44 mm Surface area: 677 cm²
HS 6065	R = 5°C/W Dimensions: 76 mm x 38 mm x 24 mm Surface area: 387 cm²
HS 6071	R = 1.4°C/ W (vertical) R = 1.8°C/W (horizontal) Dimensions: 76 mm x 92 mm x 26 mm Surface area: 968 cm²
HS 6105	R = 1.8°C/ W (vertical) R = 2.1°C/W (horizontal) Dimensions: 76 mm x 127 mm x 91 mm Surface area: 677 cm²
HS 6115	R = 1.1°C/ W (vertical) R = 1.3°C/W (horizontal) Dimensions: 76 mm x 102 mm x 25 mm Surface area: 929 cm²
HS 7030	R = 2.9°C/ W (vertical) R = 3.1°C/W (horizontal) Dimensions: 76 mm x 97 mm x 19 mm Surface area: 290 cm²
Device	Combined natural convection and radiation thermal resistance
TO-3	5 °C/W (Junction to Case) 60 °C/W (Junction to Air)
TO-39	12 °C/W (Junction to Case) 140 °C/W (Junction to Air)
TO-220	3 °C/W (Junction to Case) 62.5 °C/W (Junction to Air)
TO-220FB	3 °C/W (Junction to Case) 50 °C/W (Junction to Air)
TO-223	30.6 °C/W (Junction to Case) 53 °C/W (Junction to Air)
TO-252	5 °C/W (Junction to Case) 92 °C/W (Junction to Air)
TO-263	23.5 °C/W (Junction to Case) 50 °C/W (Junction to Air)
1 sq inch of 1 ounce PCB copper	43 °C/W
.5 sq inch of 1 ounce PCB copper	50 °C/W
.3 sq inch of 1 ounce PCB copper	56 °C/W
Aavid Thermalloy, SMT heat sink: PN:573400D00010	14 °C/W