Natural Convection Radiation Thermal Resistance Table of Heat Sinks

Heat Transfer Engineering
Thermodynamics
Engineering Physics

Combined natural convection and radiation thermal resistance of various heat sinks used in the cooling of electronic devices between the heat sink and the surroundings. All fins are made of aluminum 6063T-5, are black anodized.

HS 5030
HS 5030
R = 0.9°C/ W (vertical)
R = 1.2°C/W (horizontal)
Dimensions: 76 mm x 105 mm x 44 mm
Surface area: 677 cm2
HS 6065
HS 6065
R = 5°C/W
Dimensions: 76 mm x 38 mm x 24 mm
Surface area: 387 cm2
HS 6071
HS 6071
R = 1.4°C/ W (vertical)
R = 1.8°C/W (horizontal)
Dimensions: 76 mm x 92 mm x 26 mm
Surface area: 968 cm2
HS 6105
HS 6105
R = 1.8°C/ W (vertical)
R = 2.1°C/W (horizontal)
Dimensions: 76 mm x 127 mm x 91 mm
Surface area: 677 cm2
HS 6115
HS 6115
R = 1.1°C/ W (vertical)
R = 1.3°C/W (horizontal)
Dimensions: 76 mm x 102 mm x 25 mm
Surface area: 929 cm2
HS 7030
HS 7030
R = 2.9°C/ W (vertical)
R = 3.1°C/W (horizontal)
Dimensions: 76 mm x 97 mm x 19 mm
Surface area: 290 cm2
Device
Combined natural convection and radiation thermal resistance
TO-3
TO-3
5 °C/W (Junction to Case)
60 °C/W (Junction to Air)
TO-39
TO-39
12 °C/W (Junction to Case)
140 °C/W (Junction to Air)
TO-220
TO-220
3 °C/W (Junction to Case)
62.5 °C/W (Junction to Air)
TO-220FB
TO-220FB
3 °C/W (Junction to Case)
50 °C/W (Junction to Air)
TO-223
TO-223
30.6 °C/W (Junction to Case)
53 °C/W (Junction to Air)
TO-252
TO-252
5 °C/W (Junction to Case)
92 °C/W (Junction to Air)
TO-263
TO-263
23.5 °C/W (Junction to Case)
50 °C/W (Junction to Air)
1 sq inch of 1 ounce PCB copper 
43 °C/W
.5 sq inch of 1 ounce PCB copper 
50 °C/W
.3 sq inch of 1 ounce PCB copper 
56 °C/W
Aavid Thermalloy, SMT heat sink:  PN:573400D00010
14 °C/W
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